As a Senior Engineer you will develop, analyze, and report on laboratory results that isolate final product electronic module component and device level failures. You will inform quality, test and design engineering on selection, application of failure analysis tools and techniques applicable to troubleshoot and isolate defectivity through root cause of electronic components and systems. You will recommend test methods and various FA laboratory control procedures for achieving required levels of product fault isolation and root cause. You will understand all test and product reliability requirements of components and systems to achieve company and customer and any governmental agency reliability objectives. You will develop new techniques and analytical tools to assure the early identification of potential problems with new products, packaging, processes, and product reliability. You will provide laboratory findings to support recommendations for changes in the selection and application of components and systems. You may propose changes in design or formulation to improve system and/or process reliability based upon proven laboratory methods.

Engineering knowledge or coursework in digital CMOS and HBJT RF constructs and associated devices. Perform physical analysis and perform construction analysis on electronic components including multi-chip modules, semiconductor die, surface mount components, printed circuit boards and wire-bond and flip chip modules. Communicate and interface with quality, reliability, and design teams to isolate failures and determine root cause. Prepare competitive analysis reports and provide physical analysis measurements by optical and SEM imaging.

BS degree in Engineering with 5 years’ experience. Strong understanding of electrical circuit fundamentals and basic physical failure analysis tools and techniques. Ability to troubleshoot and debug complex systems (hardware and test interfaces).Experience with printed circuit board and chip design schematic capture and layout software tools. Excellent written and verbal communication skills and with the ability to report, as well as present, technical concepts and lab results in a direct and concise manner to a wide range of audiences including more senior engineers and management teams. Advanced analytical skills to analyze problems and technical situations leading to optimal solutions. Proficiency in Microsoft Office software including Outlook, Word, Excel, and PowerPoint.

Desirable to have prior knowledge or familiarity in the areas of failure analysis tools and techniques including Visible, NIR and IR microscopes, X-RAY CT imaging, SEM (scanning electron microscope), Acoustic microscopy (CSAM), Silicon (Si) and Gallium Arsenic (GaAs) wet/dry etching tools and techniques and mechanical polishing and sample preparation techniques. Experience with digital and RF test equipment and measurements. A great attitude with an eagerness to learn and the ability to adapt to new technical challenges. Ability to build relationships easily and collaborate effectively.