I applied through college or university. The process took 3 weeks. I interviewed at Huawei Technologies (Kuala Lumpur) in Oct 2023
Interview
Transparent about stressful working culture upfront. Consist of 3 rounds, the first round was conducted with HR. The second round was the technical interview with two person coming from the background. The third round interview with the hiring manager.
Interview questions [1]
Question 1
TCP/OSI Design a simple network Advantage disadvantage of certain transmission medium Topics related to datacom
4 interview with expert
I got the contacted by outsourcing resource company
All interviews were technical
Massive questions in routing speacially for ISPs
That had to do all intervews via phone call
The process was not cinducted by HR is wasnt coear at the begging
they have three phases of interview. the first is the initial with hr which is followed by the technical with their engineers then one final interview with the head of their department.
I interviewed at Huawei Technologies (Roma) in Mar 2025
Interview
Colloquio conoscitivo, mi ha chiamato il recruiter e mi ha fatto una domanda tecnica sull'OSPF e poi classiche domande: Perchè hai inviato la candidatura, dove ti vedi tra 5 anni ecc..