All questions were related with the job description. The panel of 4 seemed unprepared to interview. One of the managers looked like he just rolled out of bed. Seemed to me they wanted to check the box and moved on. On a positive note the whole process was fast.
Name a time you had to deal with a difficult customer
Introduce yourself
How did you control plasma? Without temperature how do you control etch uniformity? Which tools of plasma etchers affected how in your process? How do you control plasma density? How do you control uniformity with focus ring? Why low temperature makes higher deposition?
What were your past projects like? What was your FYP about?
I expect to be able to provide the contribution to Qualcomm
it was a complete technical interview
Please elaborate on your thesis and how it relates to our product / process?
Questions based on metal pourbaix diagrams in water.
We only talked about my experiences, education (junior position)
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